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![Advancing BoW in 2024 – Key Developments and Future Directions](https://static.wixstatic.com/media/53b127_749c1f355de84f2192aefc9c8cb2fb65~mv2.jpg/v1/fill/w_454,h_272,fp_0.50_0.50,q_90,enc_auto/53b127_749c1f355de84f2192aefc9c8cb2fb65~mv2.webp)
Latitude Design Systems
Jul 1, 20243 min read
Advancing BoW in 2024 – Key Developments and Future Directions
Introduction In the rapidly evolving landscape of semiconductor technology, the Bunch of Wires (BoW) protocol stands out for its...
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![A Low-Power Inverter-Based AC-Coupled Link for Die-to-Die Communication](https://static.wixstatic.com/media/53b127_78938eb63ff24fda8b32e52df9c471b2~mv2.jpg/v1/fill/w_454,h_341,fp_0.50_0.50,q_90,enc_auto/53b127_78938eb63ff24fda8b32e52df9c471b2~mv2.webp)
Latitude Design Systems
Jun 27, 20244 min read
A Low-Power Inverter-Based AC-Coupled Link for Die-to-Die Communication
Introduction As the demand for high-performance computing continues to grow, there is an increasing need for high-density, low-power...
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