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System Design Technologies and Methods in 3D Integration
Introduction With the continuous advancement of semiconductor technology, advanced packaging has been playing an increasingly crucial...
Latitude Design Systems
Feb 212 min read
Mastering Interconnects: The Key to Unlocking Heterogeneous Integration
Introduction As the semiconductor industry transitions from monolithic system-on-chip (SoC) designs to heterogeneous integration with...
Latitude Design Systems
May 6, 20244 min read
Photonics for Die-to-Die Interconnects: Optical I/O Chiplets and Links
Ayar Labs' Shasta optical I/O chiplet hits 4 Tbps full-duplex with <4 pJ/b, demonstrating integrated photonics chiplets bridging off-package
Latitude Design Systems
Mar 8, 20246 min read
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