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IEDM2024|Hybrid Bonding Technology for 3D Chiplet AI Applications
Introduction Hybrid bonding technology is an innovative ultra-fine pitch interconnect method, suitable for high-performance chiplet...

Latitude Design Systems
May 283 min read


AMD | Development of Cache Architecture from Planar to 3D Integration
Introduction With the rapid advancement of computing technology, the relationship between cache architecture and chiplet technology plays...

Latitude Design Systems
Mar 183 min read


The Development and Current Status of Chiplet Technology
Introduction The semiconductor industry is undergoing significant transformation, with the application scope of chiplet design solutions...

Latitude Design Systems
Mar 173 min read


Chiplet Placement Design in 2.5D IC Considering Thermal Effects
Introduction As Moore's Law approaches its physical limits, the semiconductor industry is shifting toward advanced technologies such as...

Latitude Design Systems
Feb 183 min read


Optical I/O: The Breakthrough Technology for Scaling AI
Introduction As artificial intelligence systems continue to grow in size and complexity, the need for high-speed, energy-efficient...

Latitude Design Systems
Jun 20, 20243 min read


Chiplet Design and Heterogeneous Integration Packaging
Introduction The semiconductor industry has identified five major growth engines (applications): mobile, high-performance computing...

Latitude Design Systems
Jun 12, 20244 min read


Intel's Optical Compute Interconnect (OCI) - Enabling Massive AI Scaling
Introduction As artificial intelligence (AI) applications become increasingly pervasive, driving our global economy and influencing...

Latitude Design Systems
Mar 25, 20242 min read


Enabling the Future of High-Performance Computing and AI with Ayar Labs' TeraPHY Optical I/O Technology
Terence S.-Y. Chen, Latitude Design Systems Abstract This white paper provides an overview of Ayar Labs' innovative TeraPHY optical...

Latitude Design Systems
Oct 9, 20234 min read
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