Will 50% of New High-Performance Computing (HPC) Chip Designs in 2025 Adopt Multi-Chip Architectures?

Introduction

The semiconductor industry is at a critical turning point, with the high-performance computing (HPC) sector rapidly moving towards multi-chip designs. According to industry forecasts, by the end of 2025, 50% of new HPC chip designs will adopt multi-chip solutions. This article briefly discusses this major shift in chip architecture, analyzes how past technical challenges have been addressed, and explores the technological and market drivers behind this prediction [1].

Fundamentals of Multi-Chip Architecture

Multi-chip solutions fundamentally differ from traditional monolithic chip designs. Instead of manufacturing a large single chip, multiple semiconductor dies are integrated into a single package. This architectural innovation achieves new levels of performance optimization while offering greater design flexibility and cost efficiency. Significant advancements have been made in key areas such as interconnect technology, thermal management, and power delivery.

Figure 1 presents market forecast data from Synopsys, illustrating the expected adoption rates of multi-chip designs across different market sectors, with a particular emphasis on the HPC sector reaching 50% by the end of 2025.

Historical Challenges and Solutions

The development of multi-chip technology has faced several critical technical obstacles. In the early stages, interconnect technologies struggled to meet the bandwidth and latency requirements needed for chip-to-chip communication. Thermal management was another key challenge, as engineers had to address heat dissipation issues in high-density multi-chip configurations. Power delivery systems also required complex improvements to accommodate the varying demands of different dies within the same package.

Beyond technical challenges, the industry also faced standardization issues. The lack of a unified chiplet interface standard limited design flexibility and hindered the seamless integration of components from different vendors. Additionally, advanced packaging methods such as silicon interposers and 3D stacking were expensive, and the supply chain remained incomplete.

Key Technological Breakthroughs Enabling Multi-Chip Success

In recent years, multiple technological breakthroughs have resolved these historical challenges. The development of through-silicon vias (TSVs) and silicon interposers has revolutionized chip-to-chip communication, enabling efficient, low-latency data transmission. The introduction of the Universal Chiplet Interconnect Express (UCIe) standard has been particularly significant, facilitating interoperability between solutions from different vendors.

Figure 2 showcases innovative multi-chip design solutions implemented by leading semiconductor companies, highlighting various architectural approaches and technological breakthroughs.

Advantages and Economic Impact

The benefits of multi-chip solutions extend beyond technical improvements. This approach delivers superior performance by enhancing interconnectivity and reducing latency. By integrating heterogeneous components such as processors, accelerators, and memory within a single package, designs can be precisely optimized for specific workloads.

From an economic standpoint, multi-chip architectures offer a compelling value proposition. As traditional semiconductor process nodes approach physical and economic limits, combining smaller dies through advanced packaging provides a cost-effective solution. This modular approach improves manufacturing yield rates and shortens development cycles.

Market Drivers and Industry Adoption

The adoption of multi-chip solutions is well-timed to meet the increasing demand for scalable and energy-efficient computing architectures. The rise of artificial intelligence, high-performance computing, and data analytics has created an environment where the unique advantages of multi-chip designs are highly desirable.

Industry leaders such as AMD, Intel, Microsoft, and NVIDIA have already demonstrated the feasibility of multi-chip architectures in their flagship products. The ecosystem continues to evolve with strong supply chain support and advanced design tools. For example, Synopsys' 3DIC Compiler, 3DSO.ai, and inter-chip IP solutions simplify the design and integration process, reducing time to market.

The semiconductor industry is clearly moving toward broader adoption of multi-chip solutions. With most technological barriers overcome and economic benefits well-established, Synopsys' forecast that 50% of new HPC chip designs in 2025 will adopt multi-chip architectures not only seems achievable but may even be conservative. As demand for more powerful and energy-efficient computing continues to grow, multi-chip architecture will play a central role in the evolution of semiconductor design and high-performance computing.

References

[1] K. Rajendiran, "Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?," SemiWiki, Jan. 28, 2025. [Online]. Available: https://semiwiki.com/ip/352531-will-50-of-new-high-performance-computing-hpc-chip-designs-be-multi-die-in-2025/ [Accessed: Feb. 1, 2025]