While packaging, assembly, and testing are only a small part of the cost of electronic systems, the reverse happens with photonic integrated circuits (PICs) and their subassemblies. Researchers at the Technical University of Eindhoven (TU/e) estimate that for most Indium Phosphide (InP) photonics devices, the cost of packaging, assembly, and testing can reach around 80% of the total module cost.
To trigger a revolution in the use of photonics worldwide, it needs to be as easy to manufacture and use as electronics. In the words of EFFECT Photonics’ Chief Technology Officer, Tim Koene: “We need to buy photonics from a catalog as we do with electronics, have datasheets that work consistently, be able to solder it to a board and integrate it easily with the rest of the product design flow.”
This article will explore three key avenues to improve optical subassemblies and packaging for photonic devices.
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