Introduction
The integration of artificial intelligence (AI) and optical communication is reshaping the landscape of data center infrastructure. With DeepSeek introducing more cost-effective AI models, the demand for high-speed optical communication components is rapidly increasing. This article explores how advancements in AI technology are driving the development of optical communication technologies and their impact on the future of data centers [1].
Market Growth and Technological Drivers
The optical communication industry is experiencing significant growth, primarily driven by the increasing demand for AI infrastructure. According to TrendForce analysis, global shipments of high-speed optical transceivers (400G and above) reached 6.4 million units in 2023. The market is expected to grow to 20.4 million units in 2024 and further expand to 31.9 million units in 2025, with an annual growth rate of 56.5%.
This growth is not just reflected in numbers but also represents a fundamental shift in how data centers are designed and deployed. DeepSeek’s innovations in reducing AI training costs have triggered a chain reaction, accelerating AI adoption across industries. This shift requires robust communication infrastructure to support unprecedented data transmission speeds.
Edge Computing and Industrial Implementation
The expansion of AI applications is pushing computing to the edge, transforming traditional industrial environments. Factories and wireless base stations are increasingly becoming micro-data centers, requiring complex optical communication networks. This transition has significantly increased the density of optical communication nodes, with the number of such nodes in factories growing 3 to 5 times compared to traditional architectures.
The deployment density of optical transceivers is becoming particularly important in industrial settings. These components must not only support high-speed data transmission but also ensure reliability under various environmental conditions. The shift toward edge computing represents a major change in how data center architectures and optical communication deployments are approached.
Core Technologies and Components
The core of optical communication systems consists of three key components that enable high-speed data transmission: laser diodes, modulators, and photodetectors.
Laser diodes generate the initial optical signal, serving as the foundation of data transmission. In high-speed applications, Electro-Absorption Modulated Laser (EML) diodes are favored due to their superior modulation capabilities. However, achieving single-channel transmission speeds of 100Gbps or 200Gbps presents significant technical challenges.
Modulators bridge the gap between electrical and optical signals, encoding data onto optical waves. This process requires precise control and sophisticated engineering to maintain signal integrity. The development of silicon photonics has introduced new possibilities, particularly in integrating continuous wave (CW) lasers with modulation components.
Photodetectors complete the communication circuit by converting received optical signals back into electrical signals. As transmission speeds increase, the efficiency of these components becomes increasingly critical. For 200G-per-channel applications, manufacturing processes become more complex, requiring special attention to material doping uniformity and epitaxial layer quality.
Supply Chain Dynamics and Manufacturing Innovations
The supply chain for optical communication components is complex, dominated by established enterprises while also creating opportunities for emerging manufacturers. Major companies from the United States and Japan, such as Broadcom, Coherent, and Lumentum, maintain significant control over EML laser production, often keeping manufacturing processes in-house to protect technological advantages.
However, the rise of silicon photonics has created new opportunities for Taiwanese manufacturers to enter the market, especially in CW laser production. Companies such as Landmark Optoelectronics, LuxNet, and Truelight have successfully leveraged their expertise in laser chip manufacturing to establish themselves in the CW laser supply chain.
The photodetector sector faces unique challenges as transmission speeds increase. For example, 200G-per-channel avalanche photodiode (APD) detectors require highly precise manufacturing processes. While Broadcom retains in-house production of these components, other major companies like Coherent, Lumentum, and Hamamatsu rely on specialized partners such as IET in the United States for epitaxial wafer manufacturing.
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