System Design Technologies and Methods in 3D Integration

Introduction

With the continuous advancement of semiconductor technology, advanced packaging has been playing an increasingly crucial role in modern computing systems. This article explores the current state, methodologies, and future directions of 3D integration technology.

Development of Advanced Packaging Technologies

As the cost of monolithic chip production continues to rise, partitioned design has gradually demonstrated its advantages. Advanced packaging technologies are becoming an essential solution in the semiconductor industry. Market analysis predicts that advanced packaging revenue will grow at a 10% compound annual growth rate (CAGR) from 2022 to 2028.

Figure 1 illustrates the advanced packaging revenue growth trends of different packaging platforms, reflecting the industry's direction up to 2028.

Evolution of Packaging Manufacturing Technologies

The development of packaging technology has undergone several significant stages. The traditional packaging method after wafer dicing has evolved from simple PTH/DIP and QFP packages to more complex BGA solutions. Since the first monolithic microprocessor in 1971, which had a density of approximately 19,000 transistors per square centimeter, device density has grown exponentially.

Figure 2 illustrates the technological evolution from traditional 2D/MCP solutions to advanced 3D integration solutions.

Innovative Modern Packaging Solutions

The industry has developed various breakthrough solutions to address current challenges. The Industrial Technology Research Institute (ITRI) in Taiwan has introduced a new pre-packaged service that provides significant advantages for rapid prototyping and system integration.

Figure 3 presents the concept of pre-packaged bodies for rapid prototyping of 3D integrated circuits, showcasing the integration of different components and wiring layers.

Signal Integrity and Design Considerations

In modern packaging design, optimizing interconnect density while maintaining signal integrity is a key consideration. Various methods have been developed to address these challenges, including misaligned vias and teardrop designs.

Figure 4 compares different solutions such as misaligned vias and stacked vias, illustrating their impact on signal integrity and mechanical reliability.

The Role of Chiplets in Modern System Design

Chiplets have become an essential solution for implementing complex systems, though they also introduce a range of challenges and considerations. The industry is actively promoting standardization efforts to facilitate broader adoption and interoperability.

Figure 5 compares traditional packaging methods with innovative programmable packaging solutions, highlighting the evolution towards more flexible and efficient designs.

Standardization and Future Directions

The semiconductor industry is advancing standardization efforts for Chiplet-based designs, with several major initiatives underway. These standards cover various aspects, including inter-chiplet protocols, physical descriptions, and testing methodologies.

Advanced packaging technologies are particularly suited for high-performance computing and artificial intelligence systems. The system technology co-optimization (STCO) approach is becoming increasingly important in optimizing cost and performance metrics. Additionally, advancements in predictive modeling capabilities and comprehensive cost feasibility studies will play a crucial role in driving the development of this field.

References

[1] H.-M. Chen, "Enabling System Design in 3D Integration: Technologies and Methodologies," in ISPD 2024, Institute of Electronics and SoC Center, National Yang Ming Chiao Tung University, Taiwan, 2024.