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Photonic integrated circuits delivering next-gen optical communications

Photonic integrated circuits

In March, OpenLight demonstrated a 224G Indium phosphide-based modulator available for Tower’s PH18DA platform, in a move expected to enable faster communication speeds.

The new 224G modulator is integrated on a demonstration photonic integration circuit (PIC)with a heterogeneous integrated laser and other required silicon photonics components to enable a full transmitter. Fabricating these components on a heterogeneous silicon photonics platform enables significant gains in yield, decrease of production complexity, and improved performance.

Measured as part of a fully operational PIC, OpenLight extended the speed of its PAM4modulator and demonstrated a PAM4 224G eye.

“200G modulation is a key building block and critical path to the delivery of next-generation Ethernet speeds based upon 200G/lane,” said Jim Theodoras, Vice President of Research and Development at HGGenuine USA. “This is not just a 200G modulator, but one that is available in a hybrid photonic integrated circuit. Next generation Ethernet cannot be delivered at the power and densities being requested by datacom customers without photonic integrated circuits.”

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