ASE | Advanced Chiplet Integration: Design, Technology, and Implementation

Introduction

Chiplet integration technology has become a crucial development in advanced packaging, providing a solution to overcome the limitations of traditional monolithic chip design. This technology enables the integration of multiple dies within the same package, offering greater flexibility, performance, and cost-effectiveness in semiconductor manufacturing [1].

Design Platforms and Tools

Chiplet design platforms integrate comprehensive tools and methodologies to address various design challenges. These platforms incorporate design and verification tools from different vendors to streamline workflows.

Figure 1 illustrates the chip-to-package I/O platform for chiplet integration, showing the interconnection relationships between different design layers.

Advanced Packaging Integration

chiplet integration primarily relies on advanced packaging technologies, including multiple die-to-die interconnection methods. The industry has developed standardized approaches through UCIe (Universal Chiplet Interconnect Express), covering the entire protocol stack from the transaction layer to the package.

Figure 2 presents the chip-to-package I/O platform for chiplet integration, demonstrating the complete layout and interconnection design.

Mechanical Analysis and Simulation

Mechanical analysis and simulation are critical aspects of chiplet integration, including the following:

• Evaluating chip-to-package warpage using shadow moiré technique

• Modeling mechanical behavior through finite element methods

• Assessing the long-term reliability of Chiplet integration designs

Figure 3 illustrates the advanced mechanical analysis workflow for chiplet integration, detailing the different stages of analysis and simulation.

Die-to-Die Interface Standards

Standardization of die-to-die interfaces is a significant advancement in chiplet integration. The UCIe specification defines the following key attributes:

• Physical layer specifications

• Transaction layer protocol

• Packaging requirements

Figure 4 presents the UCIe physical layer (PHY) block diagram for advanced packaging modules, detailing the interface architecture.

Performance and Verification

Performance validation of chiplet integration involves extensive testing and verification processes, including:

• Electrical performance analysis under various I/O conditions

• Thermal management evaluation

• Signal integrity validation

• Power distribution analysis

Figure 5 compares warpage measurements and mechanical simulation results for a 2.5D package with two integrated chiplets.

Conclusion

The development of chiplet integration technology continues to drive innovations in semiconductor packaging. A comprehensive design approach, combined with standardized interfaces and advanced analysis tools, enhances the efficiency and reliability of heterogeneous integration solutions. Through UCIe, the industry has standardized die-to-die interconnections, promoting the widespread adoption of chiplet technology across different vendors and application domains.

References

[1] L. Cao, C. Wang, C. Huang and H. Kuo, "Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Austin, TX, USA, 2024, pp. 1048-1053, doi: 10.1109/ECTC51529.2024.00168.